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New entry into the increasingly sophisticated removal, reinstallation and maintenance equipment market for surface-mounted components!

New entry into the increasingly sophisticated removal, reinstallation and maintenance equipment market for surface-mounted components!

Our unique heating method (direct heating method) allows for quick attachment and detachment of components. Our unique camera system (two-camera system) facilitates easy alignment of components and circuit boards (patent pending).

In line with the development of multimedia-related products such as personal computers and mobile devices, component functionality has not only increased, but miniaturization, high density, fine pitch, and multi-pin (BGA, QFP, CSP) have also progressed rapidly. Furthermore, in response to environmental concerns that have gained attention in recent years, there is a new trend to replace already mounted lead-containing components, and the environment surrounding the circuit board and component industry is facing a challenging situation with increasing costs related to the manufacturing, inspection, and maintenance of surface mount components. However, the performance of existing equipment is currently unable to keep up with the growing demand from users for increased operational efficiency.

The newly developed rework station "RW-1000" employs a unique, highly thermally efficient heating method (direct heating method), reaching the required heating temperature in one-third the time of conventional methods, enabling the attachment and detachment of mounted components. It can also store up to 50 different temperature settings. Furthermore, its unique two-camera system (patent pending since August 1999) allows operators to easily position components with clear images during board mounting. Combined with an easy-to-understand interactive touch panel interface, this system is ideal for component maintenance and prototype mounting where improved work efficiency is crucial.

The information on this page is based on the information available at the time of publication.
Please note that if product sales are discontinued, organizational changes are made, or specifications are changed after publication, the information may differ from the latest information.

This page is created by an automatic translation system based on the information in the Japanese version. Details