Non-contact thickness measurement of conductors and semiconductors
BCD, RS-232C, and other various input/output signals
Synchronized operation of multiple units
In the fields of processing hard disks, silicon wafers, and precision parts, as processing machines become more multifunctional and precise, measuring instruments incorporated as units also require support for multifunctionality, such as automatic measurement and control by PLCs.
The newly developed non-contact thickness gauge "CL-2400" meets the demands of these fields, offering not only non-contact, high-precision thickness measurement but also enhanced communication capabilities with PLCs by implementing features such as remote control signals for smooth measurement control with external devices, status output for checking measurement status, and calibration command signal input for setting reference values of the measurement target via control from external devices. Furthermore, it comes standard with BCD output and RS-232C interface, enabling flexible system integration for measurement and control. It also features maximum, minimum, and maximum-minimum value displays crucial for quality control, synchronous operation of multiple units via synchronous input/output, and excellent operability.
The CL-2400 uses the VE series of capacitive gap detectors as its detector, supporting high-precision non-contact thickness measurement of conductors, semiconductors, and other materials.
